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Legal Resources | Education Code |  EC  15401  

School Facilities Improvement District; Method of Bond Payment   

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The board of supervisors, at the direction of the governing board of the school district or community college district in which the school facilities improvement district is located, may divide the principal amount of bonds authorized at any election into two or more series and may fix different dates for the bonds of each series, in which event the maximum maturity date of the bonds shall be calculated from the date of each series respectively. When the issuance of bonds shall have been authorized pursuant to two or more propositions submitted at the same or different elections, all or any part of the bonds not theretofore issued may be combined and issued and sold as one or more series.

(Added by Stats. 1997, Ch. 893, Sec. 64.)